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Inventi Impact - Electronic Components

Patent Watch

  • Mobile communication handset

    An antenna module (5) is such that an antenna and two power supply points for that antenna are formed on a thin substrate. A substrate module (7) has a substrate, two power supply point contact units that respectively electrically contact the two power supply points attached to the substrate, and electronic components, and processes signals received via the power supply point contact units through a circuit formed by electronic components and the power supply contact units. A pressure plate (6) is positioned between the antenna module (5) and the substrate and anchors the antenna module (5) by pressing the entire surface of such against an outside case (20), excluding the power supply points, by the outside case (20) and an inside case (21) being fastened together.

  • CONNECTING MEMBER

    A connecting member includes a cable configured to transfer signal, and a resilient component secured to the cable. The cable includes a first connector and a second connector for being electronically connected to two electronic components. The resilient component is elastically deformable between a first state, in which the resilient component and the cable are contracted, spiraled about the second connector in a first direction up to the first connector, shortening a distance between the first and second connectors, and a second state, in which the resilient component and the cable are pulled away from the first connector, thus a greater distance between the first and second connectors.

  • MULTIFUNCTION PLUG CONNECTOR OF AN OIL PAN OF A VEHICLE

    A multifunction plug connector of an oil pan of a vehicle is provided having connection to a wiring harness of the vehicle outside the oil pan. Inside the oil pan, the multifunction plug connector has a supply line cable to an electronic component. The electrical component inside the oil pan is connected via an oil-tight feedthrough through the wall of the oil pan and via a plug connector situated outside the oil pan on a wall to the wiring harness of the vehicle. The plug connector has plug contacts or plug sockets for this purpose. Inside the oil pan, the multifunction plug connector has multiple separate supply line cables to multiple electronic components, which are connected to an engine control unit via the multifunction plug connector and the wiring harness.

  • NON-SOLID CONDUCTIVE SURGE ABSORBER

    The present invention is to provide a non-solid conductive surge absorber, which comprises a non-solid conductor formed by evenly mixing a non-solid solvent and a conductive medium and filled in a shielding case thereof in a watertight manner, and a plurality of metal plates each mounted on the shielding case in a watertight manner with a first end inside the shielding case and a second end extended out of the shielding case. Therefore, when a surge is generated, the number of electric charges accumulated on the metal plate connected to a circuit due to the surge will cause the conductive medium evenly dispersed in the non-solid solvent to rapidly and electrically connect with each other, so that the electric charges can be discharged to a ground terminal through the non-solid conductor for efficiently preventing electronic components on the circuit from being damaged by the surge.

  • Laser Beam Button Weld of Dissimilar Materials

    Terminal pins comprising a refractory metal partially welded to a terminal block comprising a dissimilar metal incorporated into feedthrough filter capacitor assemblies are discussed. The feedthrough filter capacitor assemblies are particularly useful for incorporation into implantable medical devices such as cardiac pacemakers, cardioverter defibrillators, and the like, to decouple and shield internal electronic components of the medical device from undesirable electromagnetic interference (EMI) signals.

  • CASING OF ELECTRONIC DEVICE

    A casing of an electronic device includes an opening securely covered and remained unused to prevent the opening from being exposed. The casing includes a casing body and a cover plate, and the casing body has an opening and a thermoplastic pillar installed vertically inside the casing body. The thermoplastic pillar is proximate to the opening and includes a fixed portion formed at an end of the thermoplastic pillar. The cover plate is covered onto the casing body to cover the opening and has a positioning hole for passing the thermoplastic pillar, and the positioning hole is smaller than the fixed portion, such that the opening of the casing can be sealed and remained unused for a long time to achieve the effects of preventing internal electronic components from being exposed, maintaining the aesthetic appearance, preventing external pollutants from entering, and extending the lifespan of the electronic device.

  • TELECOMMUNICATION ASSEMBLY

    The invention relates to a telecommunication assembly 1 comprising, at least one termination module 2 having contacts for connecting wires and contacts for connecting electronic components and a carrier 3 for carrying the termination module, wherein the termination module is pivotally attached to the carrier and can be pivoted from a closed position relative to the carrier into an open position. The termination module 2 is attached to the carrier 3 over a pivot adapter 7 and the pivot adapter 7 is detachably attached to the carrier 3. According to the invention at least two pivot adapters 7 of at least two of the termination modules 2 are fixed to each other. The invention further relates to a method for upgrading a telecommunication assembly.

  • Stacked electronic component and manufacturing method thereof

    A stacked electronic component comprises a first electronic component adhered on a substrate via a first adhesive layer, and a second electronic component adhered by using a second adhesive layer thereon. The second adhesive layer has a two-layer structure formed by a same material and having different modulus of elasticity. The second adhesive layer of the two-layer structure has a first layer disposed at the first electronic component side and a second layer disposed at the second electronic component side. The first layer softens or melts at an adhesive temperature. The second layer maintains a layered shape at the adhesive temperature. According to the stacked electronic component, occurrences of an insulation failure and a short circuiting are prevented, and in addition, a peeling failure between the electronic components, an increase of a manufacturing cost, and so on, can be suppressed.

  • POWER CONVERSION APPARATUS

    A power conversion apparatus is provided, which accommodates electronic components configuring at least part of a power conversion circuit, and a terminal block collecting wires running from the electronic components, in a case. The terminal block includes a plurality of terminal connecting parts at which a plurality of high-voltage cables, through which electric power is received from and provided to the outside of the case, and the wires are connected to each other, and insulating parts provided between the terminal connecting parts and ensuring insulation between the high-voltage cables and between the wires. A plurality of insertion holes, into which the high-voltage cables are inserted, are formed in one side wall of the case. An opening part for performing an operation for fixing the high-voltage cables to the terminal connecting parts is formed in a wall of the case opposed to the terminal connecting parts and the insulating parts. An extending part is formed around the opening part so as to extend from a circumference of the opening part toward the terminal block side.

  • PRINTED BOARD AND ELECTRONIC EQUIPMENT INCORPORATING THE PRINTED BOARD

    A printed board includes footprints which are electrically solder-bonded to a surface-mounting substrate, on which electronic components are mounted, and which assists the heat release from the surface-mounting substrate. The footprint comprises a fillet-forming division which is placed on an outer-edge side of the surface-mounting substrate and where solder is supplied independently when solder-bonding is performed. The fillet-forming division is solder-bonded to the same electrode as the electrode of the surface-mounting substrate to which the footprint is solder-bonded.

  • ELECTRONIC DEVICE WITH THERMAL INSULATION MEMBER FOR HEAT SINK

    An exemplary electronic device includes an enclosure, two electronic components received in the enclosure, a heat sink, and a thermal insulation member. The enclosure defines a receiving space for receiving the electronic components and the thermal insulation member. Two ventilating holes are defined in the enclosure. The thermal insulating member defines a heat dissipating passage therein, communicating with the exterior via the ventilating holes of the enclosure. The heat sink is received in the heat dissipating passage and thermally coupled to the electronic components for dissipating heat from the electronic components. The heat dissipating passage is substantially thermally insulated from the part of the receiving space of the enclosure having the electronic components by the thermal insulation member.

  • DISPLAY DEVICE

    Provided is a display device including a flexible substrate having a shield electrode formed thereon, which enables reduction of a region in which components are mounted compared with that in a conventional case. The display device includes: a display panel; and a flexible substrate connected to the display panel, the flexible substrate having a plurality of electronic components mounted thereon, in which: the flexible substrate has a shield electrode on a surface thereof that is opposite to a surface thereof on which the plurality of electronic components are mounted in a region which corresponds to a region in which the plurality of electronic components are mounted; the shield electrode is supplied with a first reference voltage from outside; and at least one of the plurality of electronic components is supplied with the first reference voltage via the shield electrode.

  • ELECTRIC MOTOR

    An electric motor has a stator and a rotor rotatably mounted in the stator. The stator includes a stator core and stator windings. A heat dissipating device is mounted around an outer surface of the stator core and configured to absorb heat there from. The heat dissipating device includes a base mounted around the stator core and a plurality of fins extending outwardly from the base in the radial direction. Electronic components are mounted on the heat dissipating device. A fan is mounted on a shaft of the rotor for generating a flow of air inside the stator and through slots between the fins to thereby cool the rotor, stator core, stator windings and electronic components.

  • SYSTEM THAT PROVIDES EMBEDDED SOFTWARE TO AN EMBEDDED SYSTEM

    A system automates the provision of embedded software to an embedded system. The system may include a portable device having a portable device application that provides the embedded software to the embedded system, a communication link coupling the portable device to the embedded system, and an embedded software manager that accesses one or more embedded software components through the communication link.

  • System and method for an electronic gift key

    A system and method for a physically-based gift key enabling a purchaser to deliver a single, fully integrated gift item to a recipient and including an electronic greeting card and store credits redeemable online is presented. The method includes the steps of activating a gift key, customizing an electronic greeting card associated with the gift key at a host site via physical or wireless linkage of a gift key to a first local computer, accessing the greeting card at the host site via linkage of the gift key to a second local computer, and redeeming store credit associated with the gift key at a retail website accessible from the host site. The system includes gift key and host computer system directly or indirectly controlling a host site. A local computer automatically launches a website at host or retailer levels when the gift key is linked to the local computer.

  • Electronic control unit and vehicle behavior control device

    An electronic control unit includes a sensor circuit board 30 which is mounted with sensors 33, 34 for detecting a predetermined physical quantity; a control circuit board 20 which controls an operation of an electric component on the basis of the physical quantity detected by the sensors 33, 34; and a housing 40 which accommodates the sensor circuit board 30 and the control circuit board 20, wherein at least one of the sensor circuit board 30 and the control circuit board 20 is mounted to a circuit board support stepped portion 47 formed in an inner surface of the housing 40 so that the sensor circuit board 30 and the control circuit board 20 are arranged in a layered state.

  • Electronic device with a speaker

    An electronic device (100) having a speaker (30) located in a sealed and separate speaker enclosure is described. The electronic device includes a housing (20), a circuit board (70), a cover (60), and two connecting bodies (50). The housing includes a cavity (22) defined therein for receiving the speaker. The circuit board is electrically connected to the speaker. The cover has through holes (622) defined thereon and is disposed between the housing and the circuit board. In addition, one end of the connecting bodies connects to the speaker, and the other end of the connecting bodies is configured to resist the circuit board via the through holes to electrically connect the speaker and the circuit board.

  • Heat sink assembly, portable electronic device using same and wireless modem using the heat sink assembly

    A heat sink assembly, a portable electronic device using the same and a wireless modem using the heat sink assembly are disclosed. The heat sink assembly assembled within the portable electronic for dissipating the heat source generated within the portable electronic device to the outside. The heat sink assembly includes a frame, a cover and an absorbing sheet. The frame includes a through opening formed and surrounded thereby. The cover foldably or bendably extends outwardly from one side of the frame and is configured to be alternatively accommodated within the opening of the frame for covering the opening or forming an angle relative to the frame. The absorbing sheet is fixedly covered on the other side of the frame opposite to the cover.

  • Electronic apparatus

    The present invention is an electronic apparatus including: an electronic apparatus main body 1; a panel main body that has a first guided component guided by a first guide groove C1 formed in the electronic apparatus main body, and moves in an inclined state with respect to the electronic apparatus main body; and a hold plate 6 that has a second guided portion guided by a second guide groove C2 formed in the electronic apparatus main body, and slidably holds the panel main body. According to the present invention, a mechanism for tilting the panel main body and a mechanism for sliding the panel main body are provided separately from each other, so that the panel main body having an increased weight can be operated smoothly in the inclined state.

  • Method and system for locally activating a DRM engine

    A method for locally activating a DRM engine is disclosed. A preprocessing operation is performed, wherein rights objects are bound with digital content files with a first format. The digital content files with the first format are converted to the digital content files with a second format. The digital content files with the second format file are encrypted and a corresponding decryption key is generated. The encrypted digital content files and the decryption key are stored in a memory device. An application is designed and installed on the electronic device and the memory device is installed to the electronic device. The application is authorized according to the rights objects bound in the digital content files, decrypts the encrypted digital content files using the decryption key, wherein the digital content files with the second format can be recovered from the third format, and activates a DRM engine of the electronic device. The DRM engine binds an IMEI code of the electronic device with the digital content files, enabling the digital content files to only be accessed by the specific electronic device.

  • Device comprising multiple channel selectors

    Embodiments of the present invention comprise a television converter device, such as a set-top-box (STB), that includes two or more channel selectors and the necessary control electronics to allow each of the multiple channel selectors to operate independently. STB embodiments of the present invention may be connected to and support one or more TVs. The STB embodiments allow each connected TV to receive television programming independent of what any other connected TVs may be receiving, at a significant cost savings over providing separate STBs for each TV.

  • Signal processing apparatus and methods

    A unified system of programming communication. The system encompasses the prior art (television, radio, broadcast hardcopy, computer communications, etc.) and new user specific mass media. Within the unified system, parallel processing computer systems, each having an input (e.g., 77) controlling a plurality of computers (e.g., 205), generate and output user information at receiver stations. Under broadcast control, local computers (73, 205), combine user information selectively into prior art communications to exhibit personalized mass media programming at video monitors (202), speakers (263), printers (221), etc. At intermediate transmission stations (e.g., cable television stations), signals in network broadcasts and from local inputs (74, 77, 97, 98) cause control processors (71) and computers (73) to selectively automate connection and operation of receivers (53), recorder/players (76), computers (73), generators (82), strippers (81), etc. At receiver stations, signals in received transmissions and from local inputs (225, 218, 22) cause control processors (200) and computers (205) to automate connection and operation of converters (201), tuners (215), decryptors (224), recorder/players (217), computers (205), furnaces (206), etc. Processors (71, 200) meter and monitor availability and usage of programming.

  • LAMINATED ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME

    A laminated electronic component is configured to include substrate plating films disposed on outer surfaces of an electronic component main body through direct plating such that external terminal electrodes are connected to exposed portions of internal conductors (internal electrodes), and the average particle diameter of metal particles defining the substrate plating film is at least about 1.0 .mu.m. The external terminal electrode includes at least one layer of an upper plating film disposed on the substrate plating film. The metal particles defining the substrate plating film are Cu particles.

  • INTERLOCKING SYSTEM FOR SECURING A PRINTED CIRCUIT BOARD

    An electronic component and housing interlocking system is provided. The system includes a device housing configured to hold a printed circuit board. The printed circuit board includes a projection from a side of the printed circuit board. The system also includes a locking member having a tab coupled at a first end of the tab to a side wall of the device housing and free at a second end of the tab such that the tab is configured to flex about the first end when the printed circuit board is slid into the device housing and the projection is pushed against the second end of the tab. The tab includes an opening configured to receive the projection after being slid past the second end such that the tab engages the printed circuit board within the device housing in a locked position

  • In-Vehicle Electric Storage Device

    An in-vehicle electric storage device includes: a battery block including a metal casing and battery cells; a control unit including a metal cabinet and a circuit board on which an electronic component is mounted, the control unit being on a top side of the battery block and monitoring a physical state of the battery cells; wherein the cabinet includes a case having a bottom plate and an open top surface and a cover closing the open top surface, the case has an internal boss protrudes toward inside of the case from a top side of the bottom plate and an external boss protrudes toward outside the case from a bottom side of the bottom plate, the circuit board is on a top side of the internal boss, and a top side of the casing is provided with a depressed portion in which the external boss is accommodated.

  • HEAT VALVE FOR THERMAL MANAGEMENT IN A MOBILE COMMUNICATIONS DEVICE

    A thermal valve for controlling heat transfer between two electronic components is disclosed. The thermal valve includes a first thermally conductive strip that is secured to the first electronic component and a second thermally conductive strip that is secured to the second electronic component. The first strip and the second strip are located between the two electronic components. The first strip changes its shape toward making contact with the second strip in response to a temperature increase of the first electronic component, and the second strip changes its shape away from making contact with the first strip in response to a temperature increase of the second electronic component. Other embodiments are also described and claimed.

  • Electronic Apparatus

    According to one embodiment, an electronic apparatus includes a housing, a wiring pattern, a recess, a pad portion, and an electronic component. The wiring pattern is formed on an inner surface of the housing from an electrically conductive adhesive. The recess is in the inner surface of the housing. The pad portion is formed in the recess from the conductive adhesive and connected to an end portion of the wiring pattern. The electronic component includes a terminal which contacts the pad portion.

  • ELECTRONIC COMPONENT

    In an electronic component, a first external electrode includes a first side surface electrode provided on a first side surface and a substantially rectangular first principal surface electrode that is connected to the first side surface electrode and provided on a principal surface so as to be in contact with a first corner of the principal surface. A second external electrode includes a second side surface electrode that is connected to a capacitor conductor and provided on a second side surface and a substantially rectangular second principal surface electrode that is connected to the second side surface electrode and provided on the principal surface so as to be in contact with a second corner, which is located opposite to the first corner, the second principal surface electrode facing the first principal surface electrode in an x-axis direction, in which long sides of the principal surface extend.

  • CIRCUIT BOARD AND CIRCUIT MODULE

    A circuit board and a circuit module more accurately provide impedance matching between an antenna coil and an electronic component electrically connected to the antenna coil, and include a board body including board portions and a plurality of laminated insulating material layers made of a flexible material. An antenna coil includes coil conductors provided in the board portion. Wiring conductors are provided in the board portion and electrically connected to the antenna coil. The board portion has a structure that is less likely to deform than the board portion. An integrated circuit electrically connected to the wiring conductors is mounted on the board portion.

  • INTEGRATED ELECTRONIC DEVICE WITH EDGE-TERMINATION STRUCTURE AND MANUFACTURING METHOD THEREOF

    An embodiment of an integrated electronic device formed in a semiconductor body delimited by a lateral surface, which includes: a substrate made of a first semiconductor material; a first epitaxial region made of a second semiconductor material, which overlies the substrate and defines a first surface; a second epitaxial region made of a third semiconductor material, which overlies the first surface and is in contact with the first epitaxial region, the third semiconductor material having a bandgap narrower than the bandgap of the second semiconductor material; an active area, extending within the second epitaxial region and housing at least one elementary electronic component; and an edge structure, arranged between the active area and the lateral surface, and including a dielectric region arranged laterally with respect to the second epitaxial region, which overlies the first surface and is in contact with the first epitaxial region.

  • ELECTRONIC COMPONENT PACKAGE SEALING MEMBER, ELECTRONIC COMPONENT PACKAGE, AND METHOD FOR PRODUCING THE ELECTRONIC COMPONENT PACKAGE SEALING MEMBER

    An electronic component package includes a first sealing member and a second sealing member. The first sealing member has one principal surface on which anelectronic component element is to be mounted. The second sealing member is opposite the first sealing member. The second sealing member hermetically encloses an electrode of the electronic component element. A through hole passes through between one principal surface and another principal surface of a substrate constituting the first sealing member. A conducting material fills the through hole. A resin material seals an open end portion of the through hole at a side of the other principal surface of the substrate.

  • Use of Aliphatic Hydrocarbons and Paraffins as Solvents for Silver Sinter Pastes

    A process is provided for fastening an electronic component to a substrate, the process including the steps of: (i) providing an electronic component and a substrate; (ii) creating a sandwich arrangement having the electronic component, the substrate and a layer arranged in between them, wherein the layer includes a paste containing (a) metal particles having a coating including at least one coating compound selected from the group consisting of fatty acids, fatty acid salts and fatty acid esters, and (b) at least one aliphatic hydrocarbon compound; and (iii) sintering the sandwich arrangement.

  • System and Method for Smart Operation of an Exhaust Hood Using a Protected Monitoring Device

    A combination kitchen hood and electronic component enclosure is disclosed. The kitchen hood includes a recess into which kitchen effluents are drawn. Theelectronic component enclosure is operatively coupled to the kitchen hood and includes a container and a cover removably attachable to the container to seal theelectronic component enclosure. The electronic component enclosure defines an interior. The cover is accessible from inside the recess. Upon removal of the cover from the container, the interior of the electronic component enclosure is exposed to the recess, and upon attachment of the cover to the container, the interior of the electronic component enclosure is sealed from the recess.

  • USING IN SITU CAPACITANCE MEASUREMENTS TO MONITOR THE STABILITY OF INTERFACE MATERIALS IN COMPLEX PCB ASSEMBLIES AND OTHER STRUCTURES

    An electric potential is applied to first and second electrodes on opposite sides of a gap between an electronic component and a heat spreader. At least one of a thermal interface material in the gap, the electronic component and the heat spreader is subjected to a changing physical condition. The electrical capacitance between the electrodes is monitored during the changing physical condition. Such a method can be practiced using an array of components sharing a common heat spreader. An assembly for testing thermal interfaces includes a printed circuit board, a plurality of electronic components mounted to and operatively associated with the printed circuit board, a heat spreader positioned for absorbing heat generated by the electronic components, a first electrode associated with the heat spreader, a plurality of second electrodes associated, respectively, with the electronic component, and a device for monitoring electrical capacitances between the first and second electrodes. The technique may be employed for monitoring physical changes in electronic devices and other structures having interfaces between components.

  • ELECTRONIC COMPONENT MOUNTING METHOD AND ELECTRONIC COMPONENT MOUNT STRUCTURE

    A challenge to be met by the present invention is to provide an electronic component mounting method and an electronic component mount structure that make it possible to assure bonding strength for an electronic component whose underside is provided with bumps. In electronic component mounting operation during which an electronic component (6) whose underside is provided with bumps (7) with solder is mounted on a substrate (1), a solder bonding material (3) including solder particles contained in a first thermosetting resin is used for bonding the bumps (7) to an electrode (2) formed on the substrate (1), thereby forming a solder bonding area (7*) where the solder particles and the bumps (7) are fused and solidified and a first resin reinforcement area (3a*) that reinforces the solder bonding area (7*). Further, an adhesive (4) containing as a principal component a second thermosetting resin not including solder particles is used for fixing an outer edge (6a) of the electronic component (6) to reinforcement points set on the substrate (1). Even when the solder bonding material (3) and the bonding agent (4) are blended together, normal thermal curing of the thermosetting resin is not hindered. Bonding strength can thereby be assured for the electronic component (6) whose underside is provided with the bumps (7).

  • LISTENING DEVICE ADAPTED FOR ESTABLISHING AN ELECTRIC CONNECTION TO AN EXTERNAL DEVICE USING ELECTRICALLY CONDUCTIVE PARTS OF ONE OR MORE COMPONENTS OF THE LISTENING DEVICE

    The application relates to a miniature listening device (20) comprising a housing (200) for enclosing an energy source (23) and a number of functional (21, 22, 24, 60, 70) and/or electronic (251) components of the listening device. The application further relates to the use of such listening device, to a listening system and to a method of electrically connecting a listening device to an external device. The object of the present application is to provide a scheme for electrically connecting a miniature listening device to an external device. The problem is solved in that a first functional component comprises an electric contact part (211), which is physically accessible from outside the housing, and wherein an electronic component and/or said energy source--at least in a specific connected mode--is electrically connected to said electric contact part of the first functional component, whereby an electric connection from an external device to said electronic componentand/or to said energy source of the listening device can be established. This has the advantage of providing a listening device that uses a minimum of space on electrical contacts to external devices. The invention may e.g. be used in miniature hearing aids or ear phones or active ear plugs.

  • Thermal Management Systems for Solid State Lighting and Other Electronic Systems

    An apparatus is provided including at least one electronic component. The apparatus also includes an enclosure enclosing the at least one electronic component. The enclosure includes at least one wall defined by a membrane. The apparatus further includes a piezoelectric actuator that is fixed at a first end and rigidly attached to the membrane at a second end. Application of alternating current to the piezoelectric actuator generates a pulsating mechanical deformation of the membrane.

  • ELECTRONIC DEVICE AND METHOD OF CONTROLLING AN ELECTRONIC DEVICE

    An electronic device and a method of controlling the electronic device are provided. The electronic device receives information related to a bookmark generated by another electronic device and provides bookmarked contents based on the received bookmark related information to thereby improve user convenience.

  • METHOD OF OPTIMIZING PARAMETERS OF ELECTRONIC COMPONENTS ON PRINTED CIRCUIT BOARDS

    In a method of optimizing parameters of electronic components on printed circuit boards (PCBs), a first experiment table for m variables of one type of parameter of P electronic components on a PCB is designed using n values of each variable and the RSM. P EHs of each first experiment are obtained by simulating, and P EH empirical formulas are computed according to the P EHs. A second experiment table for the m variables is designed using n' values of each variable and the full factorial design, and P EHs of each second experiment are computed using the P EH empirical formulas. Experiments, all the P EHs of which are greater than 1, are filtered from the second experiment tables, and an average EH of each filtered experiment is computed to pick an experiment the average EH of which is the greatest. The values of the m variables in the picked experiment are considered as optimized.

  • LIFE MANAGEMENT CIRCUIT, AN ELECTRONIC SYSTEM AND A MACHINE-IMPLEMENTED METHOD FOR MANAGING USAGE RATES OF MULTIPLE ELECTRONIC COMPONENTS

    A life management circuit for managing usage rates of a plurality of electronic components includes a storage unit for storing usage information corresponding to each electronic component, a receiving unit, a determining unit and a control unit. Upon receipt of an activation command passed on thereto via the receiving unit, the control unit selects for activation, with reference to the usage information of the electronic components stored in the storage unit, at least one electronic component, the usage information corresponding to which reveals a usage rate that is comparatively lower among the electronic components, controls the determining unit to keep track of the duration of time that the selected at least one electronic component remains activated in response to the activation command, and updates the usage information corresponding to each of the selected at least one electronic component with reference to the duration of time tracked therefor.

  • PRISMATIC BATTERIES AND ELECTRONIC COMPONENTS COMPRISING A STACK OF INSULATED ELECTRODE PLATES

    A prismatic battery cell or an electronic component comprising an electrode plate group of alternately stacked positive and negative electrode plates, wherein adjacent electrode plates of opposite polarity are insulated by an insulating separator, and electrode plates of one polarity are bent to converge at a common joining location for connecting together as a lead portion, the lead portion being joined together to a current collector of that one polarity, characterized in that the electrode plates are bent after the electrode plates are stacked and held or bundled together. Shaping the electrode plates to form the lead portions while the electrode plates are held in a stack means it is not necessary to handle pre-shaped electrode plates, since handling pre-shaped electrode plates in a production line could be tedious because the electrode plates are quite easily deformable.

  • COMPACT FLUORESCENT LAMP AND LED LIGHT SOURCE WITH ELECTRONIC COMPONENTS IN BASE

    Light sources are presented in which lamp ballast or LED driver circuitry is disposed within a base assembly using integrated boards with components embedded between board layers and or circular flex boards with pot core magnetic components and/or ASICs and thermally conductive board core materials with thermal vias, reflective mirrors, and/or potting materials to conduct heat out through the base to facilitate reduced form factors for lamps and/or LED light sources.

  • ELECTRONIC COMPONENTS WITH INTEGRATED ENCAPSULATION

    An embodiment relates to an electronic component that may consist of an organic LED or organic solar cell, that comprises at least one substrate, one active layer provided between a first and a second electrode and having an active layer protected from dioxygen and the water vapor of the air by the second electrode that encapsulates the active layer.

  • DEVICE AND METHOD FOR MOUNTING ELECTRONIC COMPONENTS

    An object is to provide an electronic component mounting method in which an adequate component mounting work to which a check result is correctly reflected is enabled and it is possible to satisfy both reduction of the failure occurrence rate and improvement of the working efficiency. An electronic component mounting apparatus in which an appearance checking section which checks a board to detect existence or non-existence of a failure item, and a component mounting section which transfers and mounts an allocated mounting object component to the board in which the check is ended are integrally disposed includes a mounting availability determination processing section 28d which determines an availability of an execution of an operation of mounting the mounting object component, based on a result of detection of a failure item. In a mounting availability determining process, an availability of an execution of a mounting operation for the mounting object component is automatically determined based on preset failure patterns of the detection result.

  • MULTILAYER CERAMIC ELECTRONIC COMPONENTS AND METHOD OF MANUFACTURING THE SAME

    Disclosed are a multilayer ceramic electronic component and a method of manufacturing the same. There is provided a multilayer ceramic electronic component, including: a ceramic main body in which a plurality of dielectric layers having an average thickness of 1 .mu.m or less are stacked; and inner electrode layers formed on the dielectric layers and having connectivity of 90% or more expressed by the following Equation, wherein the ratio of the thickness of the inner electrode layer to the thickness of the dielectric layer is between 0.8:1 and 1.3:1. The Equation is as follows. CONNECTIVITY = TOTAL LENGTH ( B ) OF CROSS SECTION FORMED WITH CONDUCTIVE PASTE TOTAL LENGTH ( A ) OF CORSS SECTION OF INNER ELECTRODE ##EQU00001## The high-capacity multilayer ceramic electronic component having the excellent reliability while resisting the thermal impact cracks can be provided, by having the uniform thickness of the dielectric layers to improve the voltage-resistant characteristics while implementing the high capacitance.

  • ADAPTED TEST APPARATUS FOR ELECTRONIC COMPONENTS

    An adapted test apparatus for electronic components includes a case assembly, a plurality of first motherboard assemblies and a handler. The first motherboard assemblies are disposed in the case assembly. Each first motherboard assembly includes a motherboard, a first main connector, an adapter, a plurality of test connectors and a central processing unit (CPU). The motherboard is vertically disposed in the case assembly. The first main connector is disposed on the motherboard and electrically connected to the motherboard. The adapter is electrically connected to the first main connector and substantially perpendicular to the motherboard. The test connector is disposed on the adapter. The CPU is disposed on the motherboard and electrically connected to the motherboard. The handler inserts a plurality of electronic components into the test connectors in a vertical direction, tests the electronic components and removes the electronic components after the electronic components are tested.

  • DEVICE FOR CHARACTERISING ELECTRIC OR ELECTRONIC COMPONENTS

    The invention relates to an integrated device (PM) for characterising electric or electronic components (DUT), in particular nanometric ones, comprising a substantially insulating substrate (S) on which are provided four conducting pads (P.sub.1, P.sub.2, P.sub.3, P.sub.4), at least three resistive pads (R.sub.1, R.sub.3, R.sub.4) connecting said pads together, and a transmission line (CPW) including a signal conductor (Cc) and at least one ground conductor (C.sub.L1, C.sub.L2), wherein: said resistive pads are arranged so as to connect a first conducting pad to a second and a fourth conducting pad, and to connect said fourth conducting pad to a third conducting pad; the signal conductor of the transmission line is connected to the first conducting pad; and the ground conductor of the transmission line is connected to the third pad.

  • BONDING BASE FOR ELECTRONIC COMPONENTS, AND METHOD

    A bonding base for electronic components, and a method. The bonding base comprises: a dielectric basic layer formed of a mixture comprising thermoplastic polymer, the polymer part of which mixture comprises 75 to 95% by weight of thermoplastic PPO, the polymer part further comprising 5 to 20% by weight of elastomer which is incompatible with PPO.

  • ELASTIC CONTACT DEVICE FOR ELECTRONIC COMPONENTS WITH BUCKLING COLUMNS

    An embodiment of an elastic contact device for electrically contacting electronic components is proposed. The contact device includes at least one basic module, which has a longitudinal axis. In turn, each basic module includes an elastic core for defining an elasticity of the basic module; the elastic core undergoes an axial elastic deformation in response to an axial compression. A first contact terminal element and a second contact terminal element are coupled with the elastic core in axially opposed positions. Moreover, one or more elongated contact elements extend axially between the first terminal element and the second terminal element. In an embodiment, each elongated element is configured to have a buckling axial critical load higher than zero (for self-sustaining in absence of external forces during a production of the basic module) and lower than a threshold compression (for buckling thereby not contributing to the elasticity of the basic module during operation thereof); the threshold compression corresponds to a threshold deformation of the elastic core with respect to a rest condition of the elastic core ranging between approximately 0.1% and 50%.

  • FEEDTHROUGH CONDUCTOR FOR ELECTRONIC COMPONENTS

    The present disclosure relates to feedthrough contacts for electronic components of the type used in implantable stimulators such as, for example, cardiac pacemakers, ICDs, CRT-Ds, and/or neurostimulators. A feedthrough conductor includes a metallic electrode, wherein a part of the metallic electrode (2) has a locally enlarged diameter in the region of the passage through an opening (3) in the component housing (4). The ridge (5) formed as a result exerts pressure onto the elastic sealing material (6) disposed around the electrode (2) in a tubular shape, thereby producing a hermetic seal between the electrode surface and the sealing material (6), and between the sealing material (6) and the wall (4) of the housing opening (3). The feedthrough conductor is sealed using an adhesive material (7) on the outer side of the electronic component.

  • GOLD REMOVAL FROM ELECTRONIC COMPONENTS

    In some embodiments, a method removes gold plating on an electronic component. The method includes forming a gold and solder mixture on the electronic component via a first incrementally controlled heating procedure; incrementally cooling the electronic component via a first cooling procedure; wicking part or all of the gold and solder mixture from the electronic component to a metallic screen via a second incrementally controlled heating procedure; and incrementally cooling the electronic component via a second cooling procedure.

  • ENCLOSURE HOUSING ELECTRONIC COMPONENTS HAVING HYBRID HVAC/R SYSTEM WITH POWER BACK-UP

    An enclosure or shelter having an interior chamber for housing electronic components and equipment is provided with an HVAC/R system configured with a rechargeable DC power source for power back-up to maintain substantially uninterrupted power in the case of a main power failure. The system includes one or more variable frequency drives (VFD) controlled by a VFD controller and configured to provide three-phase power to one or more three-phase AC motors and single-phase power to one or more single-phase AC motors. The system also includes a power source controller configured to select and power sources based on availability of one or more power sources and other logic.

  • METHOD FOR SOLDERING ELECTRONIC COMPONENTS TO A CIRCUIT BOARD BY MEANS OF HIGH-FREQUENCY SOLDERING

    A method for soldering electronic components to a circuit board by: applying a solder paste to solder contacts of a circuit board and then arranging electronic components on the circuit board to keep the pins of the electronic components in contact with the solder contacts and then a high frequency to melt the solder paste and to let the pins of the electronic components be electrically connected to the solder contacts of the circuit board electrically by the solder paste.

  • STACKED SHIELD COMPARTMENTS FOR ELECTRONIC COMPONENTS

    The present disclosure is related to an electronic assembly in a stacked configuration. Electronic components are formed on substrates at each level of the stacked configuration. Electromagnetic shield compartments may be provided which substantially encapsulate the electronic components. Conductive vias are formed within the substrates on each level of the stacked configuration and coupled to one another so that the electromagnetic shields at each level of the stack can couple to a common node.

  • METHOD OF MANUFACTURING A PACKAGE FOR EMBEDDING ONE OR MORE ELECTRONIC COMPONENTS

    The present invention relates to the field of integrating electronic systems that operate at mm-wave and THz frequencies. A monolithic multichip package, a carrier structure for such a package as well as manufacturing methods for manufacturing such a package and such a carrier structure are proposed to obtain a package that fully shields different functions of the mm-wave/THz system. The package is poured into place by polymerizing photo sensitive monomers. It gradually grows around and above the MMICs (Monolithically Microwave Integrated Circuit) making connection to the MMICs but recessing the high frequency areas of the chip. The proposed approach leads to functional blocks that are electromagnetically completely shielded. These units can be combined and cascaded according to system needs.

  • MANUFACTURING OF ELECTRONIC COMPONENTS

    According to an aspect of the invention, a method is provided for manufacturing electronic components. A conducting element comprising a first portion, a second portion and a third portion between the first portion and the second portion is provided. Thermally responsive dielectric material is added at least onto the third portion of the conducting element. Electric current is supplied between the first portion and the second portion of the conducting element causing ohmic heating to affix dielectric material located on the third portion to the third portion. Non-thermally-affixed dielectric material is removed.

  • INKJET-PRINTED FLEXIBLE ELECTRONIC COMPONENTS FROM GRAPHENE OXIDE

    An electrical component includes an inkjet-printed graphene electrode. Graphene oxide flakes are deposited on a substrate in a graphene oxide ink using an inkjet printer. The deposited graphene oxide is thermally reduced to graphene. The electrical properties of the electrode are comparable to those of electrodes made using activated carbon, carbon nanotubes or graphene made by other methods. The electrical properties of the graphene electrodes may be tailored by adding nanoparticles of other materials to the ink to serve as conductivity enhancers, spacers, or to confer pseudocapacitance. Inkjet-printing can be used to make graphene electrodes of a desired thickness in preselected patterns. Inkjet printing can be used to make highly-transparent graphene electrodes. Inkjet-printed graphene electrodes may be used to fabricate double-layer capacitors that store energy by nanoscale charge separation at the electrode-electrolyte interface (i.e., "supercapacitors").

  • MOUNTING ELECTRONIC COMPONENTS ON AN ANTENNA STRUCTURE

    A method and apparatus for mounting electronic components on an antenna structure includes at least one conductive antenna element 102, an insulating layer 106 disposed on the antenna element 102, at least one electronic component 108 disposed on the insulating layer 106, and at least one electrical trace 110 disposed on the insulating layer 106 and connecting to the at least one electronic component 108. The trace follows contours of the antenna structure, such that the trace and component are electrically isolated from the antenna element.

  • CASE FOR ELECTRONIC COMPONENTS

    Provided is a case for electronic components in which an openable and closable lid is mounted to a container for housing a plurality of electronic components. The lid includes a shield projecting from its inner surface and located between two electronic components when the lid is closed so that its leading end can abut on a mounting surface on which the two electronic components are mounted.

  • SHIELDED ELECTRONIC COMPONENTS AND METHOD OF MANUFACTURING THE SAME

    A shielded electronic component including a wiring board, at least one semiconductor chip mounted on a main surface of the wiring board, a sealant which seals the whole of an upper surface of the wiring board, and a nickel (Ni) plating film formed on an upper surface of the sealant is provided. The Ni plating film is formed on a palladium (Pd) pretreatment layer formed on the upper surface of the sealant with using high-pressure CO.sub.2 in a state of protecting a back surface of the wiring board, and is electrically connected with an end portion of a ground wiring layer of the wiring board or a ground (GND) connection through-hole connected with the end portion of the ground wiring layer.

  • METHOD OF DETERMINING THE PARTICLE SENSITIVITY OF ELECTRONIC COMPONENTS

    To analyze an electronic component, this component is exposed to a focused laser beam. The information provided by the laser mapping relating to the position and to the depth of the sensitivity zones of the component is used as input parameter in prediction codes for quantifying the sensitivity of the mapped component to ionizing particles in the natural radioactive environment. The prediction codes are used to determine the occurrence of malfunctions in the electronic component. Determination of the risks associated with the radiative environment imposes two aspects: one, probabilistic, takes into account the particle/matter interaction and the other, electrical, takes into account the charge collection inside the electronic component.

  • Device for attaching electronic components to flat-screen television

    Bracket for attachment to a flat-screen television having a support platform for positioning electronic components below the television. The caddy comprises top support brackets which hook over the top of the television or over the television wall mount bracket and has a horizontal member abutting the top of the television, and front vertical extension member that extends down in front of the television. Extending down from the top support brackets are side vertical bars in back of the television. Attached to the bottom of the side vertical bars are horizontal bottom support brackets upon which the television sits. The electronic component support platform is attached to the bottom of the two side vertical bars which includes lateral and perpendicular support bars which function to support the electronic components. Many of the bars telescope allowing its use with a variety of sized televisions and electronic components of varying sizes.

  • SUCTION NOZZLE, MOUNTING APPARATUS, METHOD FOR MOUNTING ELECTRONIC COMPONENTS, AND METHOD FOR MANUFACTURING COMPONENT-MOUNTED SUBSTRATES

    A suction nozzle sucking a first electronic component that is mounted on a substrate and has first and second electrodes includes a first sucking area with an opening formed in an area corresponding to the first electrode and a second sucking area with an opening formed in an area corresponding to the second electrode.

  • TURNING MECHANISM FOR POLARIZED ELECTRONIC COMPONENTS

    A turning mechanism includes a disc-shaped rotatable carriage comprising receptacles spaced around an edge, each receptacle being adapted to receive one of polarized electronic component and including an air channel; a turn channel projecting out of the edge of the carriage, the turn channel being arc and comprising an inlet communicating with one receptacle and including a first sensor, and an outlet communicating with another receptacle and including a second sensor; an auxiliary air passageway proximate to the first sensor and projecting inward out of the turn channel, the auxiliary air passageway communicating with the turn channel and comprising an air outlet; and a polarity detector disposed externally of the carriage and being proximate to the inlet, the polarity detector being adapted to detect polarity of the polarized electronic component proximate thereto.

  • HERMETICALLY-SEALED PACKAGES FOR ELECTRONIC COMPONENTS HAVING REDUCED UNUSED AREAS

    Hermetically-sealed packages for electronic components, e.g., OLEDs, are provided. The packages have a first glass substrate (12), a second glass substrate (16), and a wall (14) that separates the first and second substrates (12,16) and hermetically seals the electronic component (18) between the substrates (12,16). The package has a reduced outer unused area characterized by distances D.sub.first (32a) and D.sub.second (32b) at least one of which, and, in certain embodiments, both of which are less than 200 microns, e.g., one or both of D.sub.first (32a) and D.sub.second (32b) is approximately 100 microns. The reduction in unused area can be used to increase viewing area, improve electrical lead design, and/or increase package strength through the use of a wider sintered frit wall (14).

  • ELECTRONIC COMPONENTS WITH REACTIVE FILTERS

    An electronic component comprising a half bridge adapted for operation with an electrical load having an operating frequency is described. The half bridge comprises a first switch and a second switch each having a switching frequency, the first switch and the second switch each including a first terminal, a second terminal, and a control terminal, wherein the first terminal of the first switch and the second terminal of the second switch are both electrically connected to a node. The electronic component further includes a filter having a 3 dB roll-off frequency, the 3 dB roll-off frequency being less than the switching frequency of the switches but greater than the operating frequency of the electrical load. The first terminal of the filter is electrically coupled to the node, and the 3 dB roll-off frequency of the filter is greater than 5 kHz.

  • TURNING MECHANISM FOR POLARIZED ELECTRONIC COMPONENTS

    A turning mechanism includes a disc-shaped rotatable carriage comprising receptacles spaced around an edge, each receptacle being adapted to receive one of polarized electronic component and including an air channel; a turn channel projecting out of the edge of the carriage, the turn channel being arc and comprising an inlet communicating with one receptacle and including a first sensor, and an outlet communicating with another receptacle and including a second sensor; an auxiliary air passageway proximate to the first sensor and projecting inward out of the turn channel, the auxiliary air passageway communicating with the turn channel and comprising an air outlet; and a polarity detector disposed externally of the carriage and being proximate to the inlet, the polarity detector being adapted to detect polarity of the polarized electronic component proximate thereto.

  • TURNING MECHANISM FOR POLARIZED ELECTRONIC COMPONENTS

    A turning mechanism includes a disc-shaped rotatable carriage comprising receptacles spaced around an edge, each receptacle being adapted to receive one of polarized electronic component and including an air channel; a turn channel projecting out of the edge of the carriage, the turn channel being arc and comprising an inlet communicating with one receptacle and including a first sensor, and an outlet communicating with another receptacle and including a second sensor; an auxiliary air passageway proximate to the first sensor and projecting inward out of the turn channel, the auxiliary air passageway communicating with the turn channel and comprising an air outlet; and a polarity detector disposed externally of the carriage and being proximate to the inlet, the polarity detector being adapted to detect polarity of the polarized electronic component proximate thereto.

  • MULTIDIMENSIONAL HEAT TRANSFER SYSTEM FOR COOLING ELECTRONIC COMPONENTS

    Devices, methods, and systems for facilitating heat transfer and cooling electronic components are presented. A system for cooling an electronic component includes a cold core, a plurality of solid state cooling devices, and a plurality of heat sinks. The cold core may define one or more cavities for receiving electronic components. The system may include an air mover and a duct. In operation, the system may cool an electronic component to sub-ambient temperatures. In other embodiments, the system may include multiple cold cores connected by liquid conduits for facilitating a flow of a cooling fluid.

  • FEEDTHROUGH CONDUCTOR FOR ELECTRONIC COMPONENTS

    The present disclosure relates to feedthrough contacts for electronic components of the type used in implantable stimulators such as, for example, cardiac pacemakers, ICDs, CRT-Ds, and/or neurostimulators. A feedthrough conductor includes a metallic electrode, wherein a part of the metallic electrode (2) has a locally enlarged diameter in the region of the passage through an opening (3) in the component housing (4). The ridge (5) formed as a result exerts pressure onto the elastic sealing material (6) disposed around the electrode (2) in a tubular shape, thereby producing a hermetic seal between the electrode surface and the sealing material (6), and between the sealing material (6) and the wall (4) of the housing opening (3). The feedthrough conductor is sealed using an adhesive material (7) on the outer side of the electronic component.

  • ELECTRONIC COMPONENT EMBEDDED PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

    The present invention relates to an electronic component embedded printed circuit board including: a substrate in which a cavity is formed; a plurality of electronic components embedded in the cavity; a metal member inserted between the plurality of electronic components; and insulating layers formed on both surfaces of the substrate to cover the plurality of electronic components, and it is possible to effectively improve heat radiation characteristics.

  • MULTI-LAYERED CERAMIC ELECTRONIC COMPONENT

    There is provided a multi-layered ceramic electronic component including: a ceramic main body including a dielectric layer; and inner electrode layers disposed to face each other, with the dielectric layer interposed therebetween, in the ceramic main body, wherein when an average thickness of the dielectric layer is defined as t.sub.d, the average thickness t.sub.d is t.sub.d.gtoreq.15 .mu.m, and the number of dielectric grains per 10 .mu.m within the dielectric layer is 15 or greater. Since a uniform, thick dielectric layer can be obtained with fine dielectric powder, a high voltage multi-layered ceramic electronic component having excellent withstand voltage characteristics can be implemented.

  • ELECTRONIC COMPONENT CARRYING DEVICE AND ELECTRONIC COMPONENT CARRYING METHOD

    A first imaging unit forming a first image by imaging a first surface of an electronic component having the first surface and a second surface, a second imaging unit forming a second image by imaging the second surface, a grasping unit grasping the electronic component, a movable unit moving the grasping unit, and a control unit detecting a position of the first surface using the first image, detecting a position of the second surface using the second image, and controlling the grasping unit and the movable unit are provided. The grasping unit brings relative positions between the grasping unit and the first surface into predetermined relative positions and grasps the electronic component using position information of the first surface detected by the control unit, and the movable unit moves the second surface to a predetermined position using position information of the second surface detected by the control unit.

  • ELECTRONIC COMPONENT AND MANUFACTURING METHOD FOR SAME

    An electronic component and manufacturing method for preparing an electronic component includes providing a first insulator layer having a first nickel content rate. A coil conductor and a second insulator layer having a first bismuth content rate and a second nickel content rate higher than the first nickel content rate are provided on the first insulator layer. The first insulator layer, the coil conductor, and the second insulator layer constitute a first unit layer. The first unit layer and an exterior insulator layer are laminated to obtain a laminate. After a step of firing the laminate, a nickel content rate in a first portion of the first insulator layer, the first portion being sandwiched between the coil conductors from both sides facing in a lamination direction, is lower than a nickel content rate in a second portion of the first insulator layer other than the first portion.

  • SEMICONDUCTOR DEVICE, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE, ELECTRONIC COMPONENT, CIRCUIT SUBSTRATE, AND ELECTRONIC APPARATUS

    A semiconductor device includes: a semiconductor substrate including a first face and a second face on a side opposite to the first face; an external connection terminal formed on the first face of the semiconductor substrate; a first electrode formed on the first face of the semiconductor substrate and electrically connected to the external connection terminal; an electronic element formed on or above the second face of the semiconductor substrate; a second electrode electrically connected to the electronic element and having a top face and a rear face; a groove portion formed on the second face of the semiconductor substrate and having a bottom face including at least part of the rear face of the second electrode; and a conductive portion formed in the groove portion and electrically connected to the rear face of the second electrode.

  • BONDING TOOL, APPARATUS FOR MOUNTING ELECTRONIC COMPONENT, AND METHOD FOR MANUFACTURING BONDING TOOL

    In some cases, it is difficult to carry out ultrasonic joining of high quality with a conventional bonding tool. A bonding tool includes: a horn that transmits an ultrasonic vibration; an ultrasonic vibrator that is provided at one end of the horn, and generates the ultrasonic vibration; and an electronic component holding part that holds an electronic component, wherein the electronic component holding part has a male fitting part in a shape of a tapering-off, and an electronic component holding face that holds the electronic component on an opposite side to the male fitting part, a female fitting part in a shape according to a shape of the male fitting part is formed in a predetermined face of the horn, and the male fitting part is fitted into the female fitting part via an adhesion layer.

  • Electronic Component and Method for Manufacturing the Same

    An electronic component that includes an electronic component body, sealing members sealing the electronic component body, and adhesive layers which adhere the electronic component body and the sealing members, respectively. Between the electronic component body and the sealing members, sealed spaces are formed, respectively. The adhesive layers each contain organic fillers and inorganic fillers. The organic fillers are in contact with both the electronic component body and the sealing members. The inorganic fillers each have a minimum particle diameter smaller than the thickness of each of the adhesive layers. When the adhesive layers are viewed in a thickness direction thereof, the inorganic fillers are provided between the organic fillers and the electronic component body and between the organic fillers and each of the sealing members.

  • PACKAGE STRUCTURE WITH ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING SAME

    A package structure comprises a substrate, a plurality of electronic components configured and structured on the substrate, a plurality of metal resilient units electrically connected to the substrate, and an encapsulation body encapsulating the plurality of electronic components and the plurality of resilient units together with the substrate. Part of each of the plurality of metal resilient units away from the substrate is exposed out of an exterior surface of the encapsulation body.

  • Electronic Component

    An electronic component includes an electrically conductive carrier. The electrically conductive carrier includes a carrier surface and a semiconductor chip includes a chip surface. One or both of the carrier surface and the chip surface include a non-planar structure. The chip is attached to the carrier with the chip surface facing towards the carrier surface so that a gap is provided between the chip surface and the carrier surface due to the non-planar structure of one or both of the carrier surface and the first chip surface. The electronic component further includes a first galvanically deposited metallic layer situated in the gap.

  • LAMINATED CERAMIC ELECTRONIC COMPONENT

    In a laminated ceramic electronic component, a first functional portion and a second functional portion are disposed within a ceramic element body so as to be adjacent to each other along a height direction, first and second internal electrodes face each other through a ceramic layer in the first functional portion, and third and fourth internal electrodes whose number of laminated layers is different from the number of laminated layers of the first and second internal electrodes face each other through the ceramic layer in the second functional portion. A marking internal conductor is disposed on the same plane as the first internal electrode and/or the second internal electrode, a marking external conductor is disposed on the side surface of the ceramic element body so as to link a plurality of exposed marking internal conductors such that it is possible to recognize vertical directionality.

  • ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT

    An electronic component has an element body, an external electrode, and an insulating material. The element body has a pair of end faces opposed to each other, a pair of principal faces extending so as to connect the pair of end faces and opposed to each other, and a pair of side faces extending so as to connect the pair of principal faces and opposed to each other. The external electrode is formed on the end face side of the element body and covers a partial region of the principal face and/or a partial region of the side face adjacent to the end face. The insulating material covers a surface of the element body except for one face which is the principal face or the side face and at least a part of which is covered by the external electrode, and the external electrode formed on the surface.

  • NEGATIVE RESIST COMPOSITION, METHOD FOR PRODUCING RELIEF PATTERN USING THE SAME, AND ELECTRONIC COMPONENT USING THE SAME

    An object of the present invention is to provide a negative resin composition which can produce a pattern with high sensitivity, high resolution and low line edge roughness in pattern formation by exposure to electron beams or EUV, a method for producing a relief pattern and an electronic component using the negative resist composition. Disclosed is a negative resist composition comprising a phenolic compound (A) which has: two or more phenolic hydroxyl groups per molecule; one or more substituents of one or more kinds selected from the group consisting of a hydroxymethyl group and an alkoxymethyl group per molecule in the ortho-position of any of the phenolic hydroxyl groups; and a molecular weight of 400 to 2,500, wherein the content of the phenolic compound (A) is 70% by weight or more of the total solid content of the negative resist composition.

  • ELECTRONIC COMPONENT AND METHOD OF PRODUCING SAME

    A laminate in which plural insulator layers are stacked includes an external electrode that is exposed to the exterior of the laminate and includes a plurality of conductive layers stacked in a staking direction and passing through some of the plural insulator layers in the stacking direction. At least one side of the external electrode facing in the stacking direction is overlaid with rest of the plural insulator layers. At least one side surface of the external electrode facing in the stacking direction is uneven with another portion of the side surface.

  • ELECTRONIC ASSEMBLY INCLUDING AN EMBEDDED ELECTRONIC COMPONENT

    An electronic unit is produced including at least one electronic component at least partially embedded in an insulating material. A film assembly is provided with at least one conductive layer and a carrier layer. The conductive layer includes openings in the form of holes for receiving bumps, which are connected to contact surfaces of the at least one electronic component. The at least one component is placed on the film assembly such that the bumps engage with the openings of the conductive layer. The at least one component is partially embedded from the side opposite of the bumps into a dielectric layer. The carrier layer of the film assembly is removed such that the surface of the bumps is exposed. A metallization layer is then deposited on the side of the remaining conductive layer having the exposed bumps and so as to produce conductor tracks that overlap with the bumps.

  • CONFIGURATIONS OF ELECTRONIC COMPONENT-CARRYING APERTURES IN A TERMINATION BELT

    A miniature component carrier includes a thin, resilient mask through which are formed multiple spaced-apart apertures each of which is sized and shaped to compliantly receive and hold a miniature component in a controlled orientation during termination processing such that the side margins of the aperture primarily contact and grip the corner regions of the miniature component. At least some of the apertures have side margins that form rhomboidal or elliptical apertures. The shape and size of the multiple spaced-apart apertures confine within an operational tolerance contact between the side margins of the aperture and the side or end wall surfaces of the electronic component. This reduces mechanical damage to the side and end wall surfaces that results from their contact with the side margins during receipt and gripping of the miniature component in the aperture.

  • CONFIGURATIONS OF ELECTRONIC COMPONENT-CARRYING APERTURES IN A TERMINATION BELT

    A miniature component carrier includes a thin, resilient mask through which are formed multiple spaced-apart apertures each of which is sized and shaped to compliantly receive and hold a miniature component in a controlled orientation during termination processing such that the side margins of the aperture primarily contact and grip the corner regions of the miniature component. At least some of the apertures have side margins that form rhomboidal or elliptical apertures. The shape and size of the multiple spaced-apart apertures confine within an operational tolerance contact between the side margins of the aperture and the side or end wall surfaces of the electronic component. This reduces mechanical damage to the side and end wall surfaces that results from their contact with the side margins during receipt and gripping of the miniature component in the aperture.

  • LEADFRAME STRIP AND MOLD APPARATUS FOR AN ELECTRONIC COMPONENT AND METHOD OF ENCAPSULATING AN ELECTRONIC COMPONENT

    A leadframe strip comprises a plurality of units arranged in a line. Each unit provides two component positions, each having a chip support substrate. The chip support substrates of the two component positions are mechanically linked by at least one support bar. The two component positions of a unit are molded at essentially the same time to produce a plastic housing for a package in each component position. The central portion of the first support bars remains outside of the plastic housing of the two packages.

  • EPOXY RESIN COMPOSITION FOR ELECTRONIC COMPONENT ENCAPSULATION AND ELECTRONIC COMPONENT DEVICE USING THE SAME

    The present invention relates to an epoxy resin composition for electronic component encapsulation, including the following components (A) to (D): (A) an epoxy resin; (B) a curing agent: an allylated phenol resin containing a structural unit (1) shown below and a structural unit (2) shown below, in which a molar ratio [structural unit (1)/[structural unit (1)+structural unit (2)].times.100] of the structural unit (1) to a total amount of the structural unit (1) and the structural unit (2) is from 40 to 100%; (C) a curing accelerator; and (D) an inorganic filler, in which the allylated phenol resin as the component (B) has a glass transition temperature of -5.degree. C. to 70.degree. C. as measured by a differential scanning calorimetry (DSC) method: ##STR00001##

  • MULTILAYER ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME

    A method for manufacturing a multilayer electronic component includes the steps of preparing a laminate including a plurality of laminated insulating layers and a plurality of internal electrodes disposed along interfaces between the insulating layers, edges of the internal electrodes being exposed at a predetermined surface of the laminate, and forming an external electrode on the predetermined surface to electrically connect exposed the edges of the internal electrodes. The step of forming an external electrode includes a plating step of forming a continuous plating film by depositing plating deposits on the edges of the internal electrodes exposed at the predetermined surface and by performing plating growth to be connected to each other, and a heat treatment step of performing a heat treatment at an oxygen partial pressure of about 5 ppm or less and at a temperature of about 600.degree. C. or more.

  • Surface Mount Electronic Component

    A surface mount electronic component that includes a resin case, metal terminals, and a sealing metal plate that are molded integrally by insert molding. A hollow casing part and a through hole are formed in the case. The through hole leads from the hollow casing part to a surface of the case. The metal plate seals the through hole. The metal plate has a coefficient of linear expansion that is different from a coefficient of linear expansion of the case so that deformation to unseal the through hole occurs when heated.

  • MULTILAYERED CERAMIC ELECTRONIC COMPONENT

    There is provided multilayered ceramic electronic component having a 0603 size or less, the multilayered ceramic electronic component including: a ceramic body including a plurality of internal electrodes and dielectric layers disposed between the internal electrodes; and external electrodes disposed on outer surfaces of the ceramic body and electrically connected to the internal electrodes, wherein when a region in which the internal electrodes are overlapped is defined as an active region in a cross section of a central portion in a length direction of the ceramic body, taken in width and thickness directions thereof, the entire area of the cross section taken in the width and thickness directions is defined as At, and an area of the active region is defined as Aa, the following equation is satisfied: 65%.ltoreq.Aa/At.ltoreq.90%.

  • ELECTRONIC COMPONENT

    An electronic component that can be prevented from being shifted from a normal mount position and can be manufactured with a low cost is provided. The component is configured by stacking a plurality of insulating layers and a plurality of inner conductors provided on the respective insulating layers. The connection conductors have respective exposure portions that are each exposed between corresponding ones of the insulating layers at a surface of the stack. An outer electrode is formed, for example, by plating on the lower surface so that the exposure portions are covered with the outer electrode. The plurality of exposure portions do not have uniform thicknesses or are not arranged at uniform intervals in the stacking direction.

  • ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME

    A laminate has a structure in which magnetic layers and a non-magnetic layer containing glass are stacked. A coil is incorporated in the laminate. The magnetic permeability .mu.2 in portions (low-magnetic-permeability portions), of the magnetic layers, which are adjacent to the non-magnetic layer and into which the glass diffuses is lower than the magnetic permeability .mu.1 in portions (high-magnetic-permeability portions), of the magnetic layers, which are not adjacent to the non-magnetic layer.

  • MULTILAYERED CERAMIC ELECTRONIC COMPONENT AND FABRICATION METHOD THEREOF

    There are provided a multilayered ceramic electronic component having outer electrodes with excellent corner coverage and adhesive strength, and a fabrication method thereof. Dummy electrodes connected to the outer electrodes are formed on cover areas and an active area of a ceramic main body. A multilayered ceramic electronic component having outer electrodes with excellent corner coverage and adhesive strength can be obtained.

  • SURFACE ACOUSTIC WAVE DEVICE AND ELECTRONIC COMPONENT

    Disclosed is a surface acoustic wave device which has IDT electrodes arranged over a lithium tantalate piezoelectric substrate and is capable of suppressing propagation losses even at a high frequency band equal to or higher than 2 GHz as low as possible in order to utilize surface acoustic waves including LSAW. For this purpose, 45.degree. to 46.degree. rotated YX-cut lithium tantalate substrate is used as the piezoelectric substrate, a thickness of the IDT electrode is set to 7.5% .lamda. to 8% .lamda., and a metallization ratio in electrode fingers of the IDT electrode is set to 0.55 to 0.65.

  • MULTILAYER ELECTRONIC COMPONENT AND MULTILAYER ELECTRONIC COMPONENT MANUFACTURING METHOD

    A multilayer electronic component and a multilayer electronic component manufacturing method are capable of easily controlling the degree of magnetic field coupling between inductors. Via-hole conductors are arranged so that they extend in a lamination direction in a laminate, and function as a first inductor. Via-hole conductors are arranged so that they extend in the lamination direction in the laminate, and function as a second inductor. A first capacitor and the first inductor define a first resonance circuit. A second capacitor and the second inductor define a second resonance circuit. The via-hole conductors are arranged in a first insulating layer so that they are spaced apart from each other by a first distance. The via-hole conductors are arranged in a second insulating layer so that they are spaced apart from each other by a second distance that is different from the first distance.

  • ELECTRONIC COMPONENT INCLUDING MULTILAYER SUBSTRATE

    The multilayer substrate includes: a plurality of dielectric layers stacked on one another; a first conductor pattern 20 which is disposed along a principal surface 12a of a dielectric layer 12 and which is electrically connected to a ground; and second conductor patterns 22 and 24 which are disposed along the principal surface of a dielectric layer and which are opposed to the first conductor pattern 20 only through the dielectric layers therebetween, the second conductor patterns 22 and 24 forming inductor elements. Only the dielectric layers that sandwich the first conductor pattern 20 therebetween are bonded to each other via openings 20a through 20h formed in the first conductor pattern 20. As viewed from the stacking direction, the second conductor patterns substantially entirely overlap a portion other than the openings 20a through 20h in the first conductor pattern 20.

  • MULTILAYER ADHESIVE SHEET AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT

    Provided is a multilayer adhesive sheet which enables easy separation between an adhesive layer and a die attach film during the pick-up even in cases where an acrylate ester copolymer is used in the die attach film, thereby making the pick-up work of semiconductor chips after the dicing easy. The multilayer adhesive sheet comprises a base film, an adhesive layer that is disposed on one surface of the base film, and a die attach film that is disposed on an exposed surface of the adhesive layer. The adhesive that constitutes the adhesive layer contains: (A) a (meth)acrylate ester copolymer; (B) an ultraviolet polymerizable compound; (C) a multifunctional isocyanate curing agent; (D) a photopolymerization initiator; and (E) a silicone polymer.

  • THERMOELECTRIC-ENHANCED, VAPOR-CONDENSER FACILITATING IMMERSION-COOLING OF ELECTRONIC COMPONENT(S)

    Cooling methods are provided for immersion-cooling one or more electronic components. The cooling method includes: providing a housing at least partially surrounding and forming a fluid-tight compartment about the electronic component(s) and a dielectric fluid disposed within the fluid-tight compartment, with the electronic component(s) immersed within the dielectric fluid; and providing a vapor-condenser, heat sink, and thermal conductive path. The vapor-condenser includes a plurality of thermally conductive condenser fins extending within the fluid-tight compartment, and the heat sink includes a first region and a second region, with the first region of the heat sink being in thermal contact with the vapor-condenser. The thermal conduction path couples the fluid-tight compartment and the second region of the heat sink in thermal contact, and includes a thermoelectric array, which facilitates transfer of heat from the fluid-tight compartment to the second region of the heat sink through the thermal conduction path.

  • CURABLE COMPOSITION FOR INKJET AND METHOD FOR PRODUCING ELECTRONIC COMPONENT

    Provided is a curable composition for inkjet applied by an inkjet method, that has a long pot life even in the environment in an inkjet device warmed to 50.degree. C. or higher and excellent insulation reliability by the cured product after curing despite containing a compound having a cyclic ether group. The composition for inkjet according to the present invention is applied by an inkjet method, and cures by heat addition, the composition for inkjet according to the present invention contains a compound having a cyclic ether group and a curing agent, and the curing agent is a reaction viscous product obtained by reacting dicyandiamide with a functional group-containing compound having a functional group reactive with the dicyandiamide.

  • CURABLE COMPOSITION FOR INKJET AND METHOD FOR PRODUCING ELECTRONIC COMPONENT

    Provided is a curable composition for inkjet applied by an inkjet method, that has a long pot life even in the environment in an inkjet device warmed to 50.degree. C. or higher and excellent insulation reliability by the cured product after curing despite containing a compound having a cyclic ether group. The composition for inkjet according to the present invention is applied by an inkjet method, and cures by heat addition, the composition for inkjet according to the present invention contains a compound having a cyclic ether group and a curing agent, and the curing agent is a reaction viscous product obtained by reacting dicyandiamide with a functional group-containing compound having a functional group reactive with the dicyandiamide.

  • LAMINATE WITH INTEGRATED ELECTRONIC COMPONENT

    The invention relates to methods for producing a laminate for contacting an electronic component, in which an insulating layer is arranged between first and second metal layers. The method includes contacting the metal layers to each other in a contact region, generating a recess in the insulating layer, laminating the metal layers to the insulating layer, generating a notch for accommodating the electronic component in the contact region in the first metal layer, inserting the electronic component in a depression in the laminate formed through a notch and recess. The electronic component is connected in a conductive manner to the second metal layer, such that an entire circumference of the electronic component is accommodated in the recess and/or notch, and at least part of the height of the electronic component is accommodated in the notch and/or recess. The invention also relates to such a laminate for contacting an electronic component.

  • LAMINATED ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF

    A laminated electronic component includes a laminate formed by alternately layering multiple internal electrodes and dielectrics, with the internal electrodes alternately exposed on the respective end faces of the laminate and two sets of external electrodes formed on them, wherein the external electrodes have a cermet layer that is film-formed by the sputtering method. Stable ESR (Equivalent Series Resistance) can be set over a wide range by changing the composition and film thickness of the cermet layer. In addition, ESR can be added that ensures low temperature coefficient and resistance to the impact of humidity change.

  • ELECTRONIC COMPONENT

    An electronic component includes a laminated body including a plurality of insulator layers laminated on each other in a lamination direction. A first strip line resonator is provided within a first region in the laminated body. A second strip line resonator is provided within a second region in the laminated body. A third strip line resonator is provided within the first region in the laminated body, and in a planar view in a lamination direction, the third strip line resonator and the first strip line resonator sandwich therebetween the second strip line resonator. A coupling conductor capacitively couples the first strip line resonator and the third strip line resonator.

  • ELECTRONIC COMPONENT PACKAGE AND PIEZOELECTRIC RESONATOR DEVICE

    An electronic component package is provided with a base on which an electronic component element is mounted and a lid that includes a conductive member and that is bonded to the base with a sealing member so as to hermetically seal the electronic component element. The base includes a bottom portion and a wall portion that extends from the bottom portion. A cavity in which the electronic component element is mounted is formed on a first main surface of the base by the bottom portion and the wall portion. The base also includes electrode pads electrically connected to electrodes of the electronic component element, external terminals electrically connected to outside and line patterns electrically connected to the electrode pads and the external terminals. The external terminals include a GND terminal for grounding. The line patterns include a wall portion GND line pattern formed on the wall portion so as to connect the lid to the GND terminal, and an electronic component element GND line pattern formed on the first main surface of the base in the cavity so as to connect the electronic component element to the GND terminal. Furthermore, a connecting portion, which connects the electronic component element GND line pattern to the wall portion GND line pattern, is disposed between layers of the bottom portion and the wall portion in plane view of the base, without being exposed in the cavity.

  • MOUNTING DEVICE FOR SECURING ELECTRONIC COMPONENT

    A mounting device for securing an electronic component includes a support base, a fixing board and a latching member. The support base includes a first track defining a first sliding direction and a second track defining a second sliding direction that intersects with the first sliding direction. The fixing board is connected to the electronic component and capable of sliding along the first track with the electronic component. The latching member is capable of sliding along the second track and includes an elastic element. The elastic element is configured to position the latching member at a desired position with respect to the support base and to provide a resilient force to the latching member, allowing the latching member to push the fixing board to cause the fixing board to abut against the support base, thereby limiting a movement of the fixing board along the first track.

  • METHOD FOR JOINING A FIRST ELECTRONIC COMPONENT AND A SECOND COMPONENT

    This invention relates to a method for joining a first electronic component with a second component using an active brazing alloy. It is the object of this invention to provide a simplified method for achieving a reliable, stress-reduced joint of a high-temperature stable piezoelectric oxidic mono-crystal. According to the method of the invention, a first component (1, 1a, 1b) and a second component (1, 2, 2a, 2b, 4, 4a) are provided, wherein the first component (1, 1a, 1b) includes a piezoelectric oxidic mono-crystal, wherein the piezoelectric oxidic mono-crystal of the first component (1), is joined with the second component (1, 2, 2a, 2b, 4, 4a) using an active brazing alloy (3), wherein the active brazing alloy (3) directly contacts the piezoelectric oxidic mono-crystal of the first component (1, 1a, 1b).

  • ANTI-CORROSION CONFORMAL COATING COMPRISING MODIFIED POROUS SILICA FILLERS FOR METAL CONDUCTORS ELECTRICALLY CONNECTING ANELECTRONIC COMPONENT

    A conformal coating comprising modified porous silica particles is disclosed. A porous silica particle, such as MCM-14 or SBA-15 is modified with a sulfur gettering functionality, such as a phosphine compound, covalently bonded to silicon atoms in the porous silica particle. The conformal coating comprising the modified porous silica particles may be applied to metallic wiring areas of a circuit component, with the sulfur gettering functionality preventing sulfur from atmospheric gasses from penetrating the conformal coating to the metallic wiring.

  • ELECTRONIC COMPONENT PACKAGING SHEET, AND FORMED ARTICLE THEREOF

    Disclosed is an electronic component packaging sheet including a surface conductive layer formed on the surface of at least one side of a substrate sheet. The substrate sheet includes 80,000 to 220,000 Mw of a styrene-conjugated diene block copolymer; 200,000 to 400,000 Mw of a polystyrene resin; and 150,000 to 210,000 Mw of an impact resistant polystyrene resin. The surface conductive layer includes an acrylic copolymer resin; and carbon nanotubes. The electronic component packaging sheet is a transparent conductive sheet having excellent thermoforming properties, good transparency after thermoforming, and sufficient electrostatic diffusion performance to maintain a low surface resistance value. The electronic component packaging sheet is particularly suited for the manufacture of embossed carrier tape.

  • ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT

    An electronic component has an element body and an external electrode arranged on the element body. The element body has a pair of end faces opposed to each other, a pair of principal faces opposed to each other, and a pair of side faces opposed to each other. The external electrode is formed so as to cover the end face and a partial region of the principal face and/or a partial region of the side face. The external electrode has a thick film electrode, a thin film electrode, and a plated layer. The thick film electrode is formed on the end face. The thin film electrode is formed so as to cover the thick film electrode and the partial region of the principal face and/or the partial region of the side face. The plated layer is formed outside the thin film electrode and contains Sn or an Sn alloy.

  • LAMINATED CERAMIC ELECTRONIC COMPONENT

    In a laminated ceramic capacitor, a cylindrical ceramic part of its ceramics includes, in a manner not exposed to the surface of the ceramics, a cylinder-shaped high-void-ratio part which has a void ratio higher than the void ratio in the cylindrical ceramic part other than the hjigh-void-ratio part and which has two layered parts facing the left and right sides of each layered conductor, respectively, as well as two layered parts facing the outer surfaces of the two outermost layered conductors, respectively. The laminated ceramic electronic component inhibits cracking of its sintered chip.

  • Arrangement For Placement And Alignment Of Opto-Electronic Components

    An arrangement for providing passive alignment of optical components on a common substrate uses a set of reference cavities, where each optical device is positioned within a separate reference cavity. The reference cavities are formed to have a predetermined depth, with perimeters slightly larger than the footprint of their associated optical components. The reference cavity includes at least one right-angle corner that is used as a registration corner against which a right-angle corner of an associated optical component is positioned. The placement of each optical component in its own reference cavity allows for passive optical alignment to be achieved by placing each component against its predefined registration corner.

  • SOCKET FOR ELECTRONIC COMPONENTS

    A socket for electronic components configured to connect each electrode terminal of an electronic component to a wiring of a wiring board with a shield member having electrical conductivity and multiple openings being disposed on the wiring board, with a contact unit configured to electrically conduct the electrode terminal of the electronic component and the wiring of the wiring board PB being disposed in the openings, and with the contact unit including a ground contacting portion configured to electrically conduct with the shield member, and when the contact unit is for grounding, grounding is performed by the ground contacting portion and the shield member being brought into contact and electrically conducting.

  • Carrier for Separated Electronic Components and Method for Visual Inspection of Separated Electronic Components

    Provided is a flat carrier provided with holders for separated electronic components, comprising: a flat metal platform with a space recessed therein and an epoxy carrier structure which is arranged form-fittingly in this space and which is provided with holders for the separated electronic components. Also provided is a method for visual inspection of separated electronic components located on such a flat carrier.

  • MULTILAYER ELECTRONIC COMPONENTS AND METHOD FOR MANUFACTURING THE SAME

    The present invention relates to a multilayer electronic component having a structure in which a dielectric layer and an internal electrode layer are alternately laminated, which includes the dielectric layer and the internal electrode layer including metal powder and an inhibitor, wherein the inhibitor includes 0.5 to 20 mol % of a Ca component based on 100 mol % of a barium titanate (BT) base material, and a method for manufacturing the same. According to the present invention, it is possible to provide a multilayer electronic component that can implement excellent electrical characteristics and electrode connectivity by adding a Ca component to an internal electrode layer as a sub-component of the inhibitor to minimize the occurrence of oxygen vacancies on the interface formed when the inhibitor component included in the internal electrode layer moves to the dielectric layer.

  • METHOD FOR DETECTING WORKING STATE OF I/O PINS OF ELECTRONIC COMPONENTS

    In a method for detecting working states of I/O pins of electronic components, a signal is transmitted between at least two of the I/O pins. A probe of an oscilloscope is connected to an I/O pin. A waveform of the signal through the I/O pin is detected. Charges are transmitted to the probe. A working state of the I/O pin is determined by detecting whether the waveform of the signal through the I/O pin is changed when the charges are transmitted to the probe.

  • INTEGRATED ELECTRONIC COMPONENTS AND METHODS OF FORMATION THEREOF

    Provided are integrated electronic components which include a waveguide microstructure formed by a sequential build process and an electronic device, and methods of forming such integrated electronic components. The microstructures have particular applicability to devices for transmitting electromagnetic energy and other electronic signals.

  • EYEGLASSES WITH ELECTRONIC COMPONENTS

    A microphone, transmitter, speaker, receiver, and power source, all mounted to an eyeglasses frame, for sending and receiving signals wirelessly to and from a remote cell phone or other electronic device. The microphone and the transmitter can be mounted to extension arms that can be extended, pivoted, or otherwise moved to a position for use, and then moved to a stored position when not in use. Alternatively, the microphone, transmitter, speaker, receiver, and power source, can be mounted onto a clip-on or other attachment member that mounts onto a conventional eyeglasses frame, or to a hat or other article worn on the head.

  • METHOD FOR MANUFACTURING ORGANIC ELECTRONIC COMPONENT HAVING SLAT COMPOUND

    A method for manufacturing an organic electronic component is provided. The method includes steps of providing a substrate and an organic material; coating the organic material onto the substrate; heating the substrate to form a first carrier transport layer; doping a material having a metal ion to an organic solvent to form an organic solution; and applying the organic solution onto the first carrier transport layer to form a second carrier transport layer.

  • PRODUCTION METHOD FOR ELECTRONIC COMPONENT AND PRESSURE-SENSITIVE ADHESIVE SHEET TO BE USED IN THE PRODUCTION METHOD

    A simplified production method for a chip-shaped electronic component such as a semiconductor chip is provided. The production method of the present invention includes: attaching a pressure-sensitive adhesive sheet to a substrate, the pressure-sensitive adhesive sheet including a base, a thermally expandable pressure-sensitive adhesive layer containing thermally expandable microspheres provided on one surface of the base, and a dielectric layer including a weak pressure-sensitive adhesive layer and an adhesive layer provided on another surface of the base in this order from a side of the base, so that the thermally expandable pressure-sensitive adhesive layer is placed on a side of the substrate; attaching and fixing a plurality of chip-shaped electronic components to a surface of the pressure-sensitive adhesive sheet on a side of the adhesive layer so that electrode surfaces of the plurality of chip-shaped electronic components are placed on the side of the adhesive layer; covering an entire surface of the plurality of chip-shaped electronic components excluding fixed surfaces with a protective substance to obtain an encapsulated body including the plurality of chip-shaped electronic components; subjecting the pressure-sensitive adhesive sheet to heating treatment to cause the thermally expandable microspheres in the thermally expandable pressure-sensitive adhesive layer to expand to decrease an adhesion of the thermally expandable pressure-sensitive adhesive layer and peeling the thermally expandable pressure-sensitive adhesive layer from the substrate; peeling the weak pressure-sensitive adhesive layer from the adhesive layer to obtain a laminate of the adhesive layer and the encapsulated body; and cutting the laminate between the plurality of chip-shaped electronic components to separate individual chip-shaped electronic components.

  • ATTACHMENT FOR PREVENTING LIQUID FROM ADHERING TO ELECTRONIC COMPONENT

    An attachment capable of preventing liquid from adhering to a specific electronic component within an electronic device. An electronic substrate has an attachment which can be attached to and detached from the electronic substrate. The attachment has an attachment part detachably attached to an edge of the electronic substrate; and a shield part connected to or integrally formed with the attachment part. The attachment part is a clip-like member having a certain degree of elasticity, and is configured to grip an edge of the electronic substrate so that the attachment is held at a predetermined place. The shield part has an inclined surface, and is configured to shield the electronic component so that liquid, such as a splash or droplet moving toward the electronic component, does not adhere to the component when the attachment is held at the predetermined place.

  • MULTILAYER CERAMIC ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME

    There are provided a multilayer ceramic electronic component and a method of manufacturing the same, the multilayer ceramic electronic component, including: a ceramic body including a plurality of dielectric layers laminated therein, each dielectric layer having an average thickness of 0.65 .mu.M or less; internal electrodes disposed to face each other while having each dielectric layer interposed therebetween in the ceramic body; and external electrodes electrically connected to the internal electrodes, wherein, when td denotes the average thickness of each of the dielectric layers and te denotes an average thickness of each of the internal electrodes, te/td.ltoreq.0.77 is satisfied.

  • MULTILAYERED CERAMIC ELECTRONIC COMPONENT AND FABRICATING METHOD THEREOF

    There is provided a multilayered ceramic electronic component including: a multilayered body in which a plurality of dielectric layers are stacked; a plurality of first and second internal electrodes formed on the dielectric layers so as to be alternately exposed through end surfaces; a minimum margin indicating part formed on an L-direction margin part on which the first or second internal electrode is not formed on the dielectric layer and indicating a minimum size of the L-direction margin part, the L-direction minimum margin indicating part being inserted on the ceramic sheet, whereby a multilayered ceramic electronic component having high capacitance while reducing a defect and having excellent reliability may be implemented.

  • ELECTRONIC COMPONENT AND ACOUSTIC WAVE DEVICE

    An electronic component has a mounting board, a bump located on a mounting surface of the mounting board, a SAW device located on the bump and connected to the bump. The SAW device has an element substrate, an excitation electrode located on the first primary surface of the element substrate, a pad located on the first primary surface and connected to the excitation electrode, and a cover located above the excitation electrode and formed with a pad exposure portion on the pad. Further, the SAW device makes the top surface of the cover face the mounting surface, makes the bump be located in the pad exposure portion, and makes the pad abut against the bump.

  • ELECTRONIC COMPONENT

    One aspect of an electronic component is an electronic component comprising an element body having a mounting surface and a plurality of side faces, the electronic component further comprising a first terminal electrode formed on the mounting surface and one of the plurality of side faces, a second terminal electrode formed on the mounting surface and another side face in the plurality of side faces, a metal film disposed on a surface of a mounting part of the first and second terminal electrodes formed on the mounting surface, and an oxide film covering at least a part of surfaces of side face parts of the first and second terminal electrodes formed on the side faces.

  • CERAMIC ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME

    There are provided a ceramic electronic component and a method of manufacturing the same. The ceramic electronic component includes: a ceramic element; and an internal electrode layer formed within the ceramic element, having a thickness of 0.5 .mu.m or less, and including a non-electrode region formed therein, wherein an area ratio of the non-electrode region to an electrode region of the internal electrode layer, in a cross section of the internal electrode layer is between 0.1% and 10%, and the non-electrode region includes a ceramic component.