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Inventi Impact: Electronic Components

Articles

  • Inventi:eec/68178/23
    A Compact Hybrid G-Band Heterodyne Receiver Integrated with Millimeter Microwave Integrated Circuits and Schottky Diode-Based Circuits
    01-Oct-2023 Research 2023 : October-December
    Kun Huang, Liang Zhang, Ruoxue Li, Yaoling Tian, Yue He, Jun Jiang, Xianjin Deng, Wei Su

    This paper presents a compact hybrid G-band (170–260 GHz) heterodyne receiver module incorporating both Millimeter Microwave Integrated Circuits (MMICs) and a Schottky diode-based circuit. An on-chip sextupler and a Low Noise Amplifier (LNA), along with a diode-based Sub- Harmonic Mixer (SHM), are integrated into the demonstrated singular module, which is carefully designed and arranged with the co-simulations in electromagnetic and thermal domain. Through this methodology, a terahertz receiver module is fabricated with a volume of only 27 × 20 × 20 mm3. The measured results indicate that the double-sideband conversion gain of the receiver is 10.5–17.5 dB from 195 GHz to 230 GHz, while the noise temperature is 1009–1158 K. As a result, this terahertz receiver provides recorded miniaturized hardware applicable for terahertz Integration of Sensing and Communication (ISAC) systems.

    How to Cite this Article
    Attribution/ CC Compliant Citation: Huang, Kun, et al. "A Compact Hybrid G-band Heterodyne Receiver Integrated with Millimeter Microwave Integrated Circuits and Schottky Diode-Based Circuits." Electronics 12.13 (2023): 2806. https://doi.org/10.3390/electronics12132806 http://creativecommons.org/licenses/by/4.0/ Some formatting elements, header, footer, logos, dates and pagination were modified while adapting this article.
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