The quality characteristics in the wafer fabrication process are diverse, variable, and fuzzy in nature. How to effectively deal with\r\nmultiresponse quality problems in the wafer fabrication process is a challenging task. In this study, the fuzzy technique for order\r\npreference by similarity to an ideal solution (TOPSIS), one of the fuzzy multiattribute decision-analysis (MADA) methods, is\r\nproposed to investigate the fuzzy multiresponse quality problem in integrated-circuit (IC) wafer fabrication process. The fuzzy\r\nTOPSIS is one of the effective fuzzy MADA methods for dealing with decision-making problems under uncertain environments.\r\nFirst, a fuzzy TOPSIS methodology is developed by considering the ambiguity between quality characteristics. Then, a detailed\r\nprocedure for the developed fuzzy TOPSIS approach is presented to show how the fuzzy wafer fabrication quality problems can be\r\nsolved. Real-world data is collected from an IC semiconductor company and the developed fuzzy TOPSIS approach is applied to\r\nfind an optimal combination of parameters. Results of this study show that the developed approach provides a satisfactory solution\r\nto the wafer fabrication multiresponse problem. This developed approach can be also applied to other industries for investigating\r\nmultiple quality characteristics problems
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